Spectrographic
Diamond Cutting Wheels - Metal Bonded (Premium)
£138
Image | Part Number | Price | Variant | Purchase Quantity |
---|---|---|---|---|
1041102 | £138.00 | Diamond wafering blade 76 x 0.15 x 12.7mm (M) LC (For use with hard/brittle materials such as Glass, Al203, Zr203, Concrete and many others) | ||
1041107 | £130.00 | Diamond wafering blade 101 x 0.3 x 12.7mm (M) HC (For general use with ferrous and non ferrous alloys, copper, aluminium, metal matrix, composites, PC boards, thermal spray coatings and titanium alloys) | ||
1043207 | £164.00 | Diamond wafering blade 125 x 0.4 x 12.7mm (R) HC (For hard, brittle or delicate materials including ceramics, carbides, composites and exotic metals) | ||
1043307 | £164.00 | Diamond wafering blade 125 x 0.4 x 12.7mm (M) HC (For cutting of aggressive material such as ceramics, refractories, glass and rock) | ||
1043107 | £164.00 | Diamond wafering blade 127 x 0.4 x 12.7mm (M) HC (For general use with ferrous and nonferrous alloys, copper, aluminium, metal matrix, composites, PC boards, thermal spray coatings and titanium alloys) | ||
1046417 | £174.00 | Diamond wafering blade 127 x 0.4 x 12.7mm (M) LC (For use with hard/brittle materials such as Glass, Al203, Zr203, Concrete and many others) | ||
1044207 | £171.00 | Diamond wafering blade 152 x 0.5 x 12.7mm (M) HC (For general use with ferrous and non ferrous alloys, copper, aluminium, metal matrix, composites, PC boards, thermal spray coatings and titanium alloys) | ||
1094127 | £161.00 | Diamond wafering blade 152 x 0.5 x 12.7mm (M) LC (For use with hard/brittle materials such as Glass, Al203, Zr203, Concrete and many others) | ||
1045307 | £190.00 | Diamond wafering blade 178 x 0.6 x 12.7mm (M) HC (For general use with ferrous and non ferrous alloys, copper, aluminium, metal matrix, composites, PC boards, thermal spray coatings and titanium alloys) | ||
1046407 | £195.00 | Diamond wafering blade 203 x 0.9 x 12.7mm (M) HC (For general use with ferrous and non ferrous alloys, copper, aluminium, metal matrix, composites, PC boards, thermal spray coatings and titanium alloys) | ||
1046417 | £175.00 | Diamond wafering blade 203 x 0.9 x 22mm (M) HC (For general use with ferrous and non ferrous alloys, copper, aluminium, metal matrix, composites, PC boards, thermal spray coatings and titanium alloys) |
Spectrographic
Diamond Cutting Wheels - Metal Bonded (Premium)
£138
Metal Bonded Diamond Wheels for use on ferrous metals, medium hard ceramics, spray coatings, MM composites & PC boards.
Each one sold as a single wheel. (M = Metal bonded) (R= Resin Bonded)
HC High concentration
LC Low concentration
Metal Bonded Diamond Wheels for use on ferrous metals, medium hard ceramics, spray coatings, MM composites & PC boards.
Standard abor size of 12.7mm (other sizes available to order) and are supplied in packs of 1.